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swg_template_wrapper.v 2.77 KiB
/******************************************************************************
 * Copyright (C) 2022, Advanced Micro Devices, Inc.
 * All rights reserved.
 *
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 * modification, are permitted provided that the following conditions are met:
 *
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 *     this list of conditions and the following disclaimer.
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 *  2. Redistributions in binary form must reproduce the above copyright
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 *  3. Neither the name of the copyright holder nor the names of its
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 *     this software without specific prior written permission.
 *
 * THIS SOFTWARE IS PROVIDED BY THE COPYRIGHT HOLDERS AND CONTRIBUTORS "AS IS"
 * AND ANY EXPRESS OR IMPLIED WARRANTIES, INCLUDING, BUT NOT LIMITED TO,
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 * PURPOSE ARE DISCLAIMED. IN NO EVENT SHALL THE COPYRIGHT HOLDER OR
 * CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL,
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 *****************************************************************************/
`timescale 1 ns / 1 ps

module $TOP_MODULE_NAME$ (
(* X_INTERFACE_PARAMETER = "ASSOCIATED_BUSIF in0_V:out_V" *)
input  ap_clk,
(* X_INTERFACE_PARAMETER = "ASSOCIATED_BUSIF in0_V:out_V" *)
input  ap_rst_n,
input  [BUF_IN_WIDTH-1:0] in0_V_TDATA,
input  in0_V_TVALID,
output in0_V_TREADY,
output [BUF_OUT_WIDTH-1:0] out_V_TDATA,
output out_V_TVALID,
input  out_V_TREADY
);

// top-level parameters (set via code-generation)
parameter BIT_WIDTH = $BIT_WIDTH$;
parameter SIMD = $SIMD$;
parameter MMV_IN = $MMV_IN$;
parameter MMV_OUT = $MMV_OUT$;

// derived constants
parameter BUF_IN_WIDTH = BIT_WIDTH * SIMD * MMV_IN;
parameter BUF_OUT_WIDTH = BIT_WIDTH * SIMD * MMV_OUT;

$TOP_MODULE_NAME$_impl
#(
    .BIT_WIDTH(BIT_WIDTH),
    .SIMD(SIMD),
    .MMV_IN(MMV_IN),
    .MMV_OUT(MMV_OUT)
)
impl
(
    .ap_clk(ap_clk),
    .ap_rst_n(ap_rst_n),
    .in0_V_V_TDATA(in0_V_TDATA),
    .in0_V_V_TVALID(in0_V_TVALID),
    .in0_V_V_TREADY(in0_V_TREADY),
    .out_V_V_TDATA(out_V_TDATA),
    .out_V_V_TVALID(out_V_TVALID),
    .out_V_V_TREADY(out_V_TREADY)
);

endmodule //TOP_MODULE_NAME